At Computex 2026, Cristiano Amon, CEO of Qualcomm, unveiled the upgraded Dragonwing IQ10 robotics platform. Designed as a complete, ready-to-use solution, the platform aims to eliminate one of the industry's biggest challenges: lengthy, complex, and costly development processes.

Previously, robotics engineers had to manually select and integrate separate computing modules when building robots. This fragmented approach often resulted in data-transfer delays, significantly increased costs, and project timelines stretching over many months. Dragonwing IQ10 addresses this issue by integrating all core functions and components onto a single board, freeing developers from much of the associated complexity.

The new platform features a powerful 18-core Oryon CPU, a multi-core AI processor, and integrated Adreno graphics. Its key advantage is an impressive 700 TOPS of computing power for artificial intelligence workloads. This enables robots to instantly recognize objects, correlate data, and analyze their surroundings locally, without relying on cloud servers.

The hardware follows an all-in-one design philosophy. It includes 64 GB of DDR5x memory and a fast 512 GB storage drive with expansion capability. The platform can process input from LiDAR systems, inertial sensors, and up to 12 high-resolution cameras without requiring additional boards. It is also designed for demanding environments, featuring protection against voltage fluctuations and reliable operation in extreme temperatures ranging from -40°C to +70°C.

On the software side, the platform runs an optimized version of Ubuntu Linux and supports the widely used ROS2 robotics framework. Selected partners will begin testing Dragonwing IQ10 this June, while mass production and a broader market release are scheduled for September.

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